Procedure To Provide Tablets Rejection Free For Packing Operation
1.0 OBJECTIVE:- 1.1 To provide tablets rejection free for packing operation. 2.0 SCOPE: 2.1 This procedure is applicable for inspection […]
sop for punch surface and die bores
Dies and Punches SOP : Procedure for cleaning and storage of dies and punches
1.0 OBJECTIVE:- 1.1 This sop for maintain the procedure for cleaning and storage of dies and punches. 2.0 SCOPE: –
Die Bores SOP : Procedure to remove scratches and burrs from punch surface and die bores
1.0 OBJECTIVE:- 1.1 To remove scratches and burrs from punch surface and die bores in production. 2.0 SCOPE: – 2.1